Thin FBGA (TFBGA) designed for space-constrained environments 6. Speed Grade / Clock Cycle Time
This field tells you total capacity and bit organization.
Separated by a hyphen, this code dictates the maximum frequency and latency characteristics.
Indicates a specific FBGA (Fine-Pitch Ball Grid Array) package layout.
: Micron Solid State Drive (e.g., 2400, 3400, or 7450 SSD series).
Micron's NAND Flash and Solid-State Drives use a similar alphanumeric matrix, though the variables focus heavily on storage cells and interface protocols. [MT] [FD] [DA] [K] [1T0] [TBD] - [1A] [1] [2] [AZ] [YY]
If you’ve ever looked at a Micron DRAM module or a raw NAND chip, you know the part number looks like alphabet soup. Strings like can be intimidating.
A single letter indicates the power requirements of the silicon: Standard Voltage (e.g., 1.2V for DDR4) K: Ultra-low voltage variants
Dictates whether the chip is DDR3, DDR4, DDR5, LPDDR, or NAND flash.
If you need help identifying a specific component, please share the or the 5-digit FBGA code printed on your chip. I can also break down the precise pin layout or timing latencies for a particular memory generation if needed. Share public link
Memory modules use a distinct numbering system (e.g., MT16VDDF12864HG-202 ). Decoding them helps determine compatibility:
Non-volatile NAND Flash memory, found in memory cards, smartphones, and SSDs, follows a slightly different matrix because it must account for cell types (SLC, MLC, TLC, QLC) and interface protocols (ONFI, Toggle). A common NAND part number is .
2 Gigabyte depth x 4-bit bus width (8Gb total chip density)
Micron provides a on their support site (Micron.com → Support → Part Number Decoder). However, it doesn’t always cover discontinued parts. This guide helps you decode those legacy modules manually.
Thin FBGA (TFBGA) designed for space-constrained environments 6. Speed Grade / Clock Cycle Time
This field tells you total capacity and bit organization.
Separated by a hyphen, this code dictates the maximum frequency and latency characteristics.
Indicates a specific FBGA (Fine-Pitch Ball Grid Array) package layout. micron memory part number decoder
: Micron Solid State Drive (e.g., 2400, 3400, or 7450 SSD series).
Micron's NAND Flash and Solid-State Drives use a similar alphanumeric matrix, though the variables focus heavily on storage cells and interface protocols. [MT] [FD] [DA] [K] [1T0] [TBD] - [1A] [1] [2] [AZ] [YY]
If you’ve ever looked at a Micron DRAM module or a raw NAND chip, you know the part number looks like alphabet soup. Strings like can be intimidating. Indicates a specific FBGA (Fine-Pitch Ball Grid Array)
A single letter indicates the power requirements of the silicon: Standard Voltage (e.g., 1.2V for DDR4) K: Ultra-low voltage variants
Dictates whether the chip is DDR3, DDR4, DDR5, LPDDR, or NAND flash.
If you need help identifying a specific component, please share the or the 5-digit FBGA code printed on your chip. I can also break down the precise pin layout or timing latencies for a particular memory generation if needed. Share public link [MT] [FD] [DA] [K] [1T0] [TBD] - [1A]
Memory modules use a distinct numbering system (e.g., MT16VDDF12864HG-202 ). Decoding them helps determine compatibility:
Non-volatile NAND Flash memory, found in memory cards, smartphones, and SSDs, follows a slightly different matrix because it must account for cell types (SLC, MLC, TLC, QLC) and interface protocols (ONFI, Toggle). A common NAND part number is .
2 Gigabyte depth x 4-bit bus width (8Gb total chip density)
Micron provides a on their support site (Micron.com → Support → Part Number Decoder). However, it doesn’t always cover discontinued parts. This guide helps you decode those legacy modules manually.